Technology

Following the phenomenal growth of the mobile market typified by smart phones and tablets, the trend of Smartization in every field , such as automotive, medical , and industrial , is expected to grow and expand into new markets, as exemplified in the expected  rise of the IoT (Internet of Things). Consequently, the demands on foundry companies, will not only be for the conventional finer fabrication processes, but also for a range of other areas, such as in further reducing the power consumption of existing technology nodes. Our company promises to meet customers’ demands with revolutionary solutions and swift actions.

GSEC  Foundry (Fab) is going to be a foundry partner that guides customers’ businesses towards success by providing technology , customization and support. Through the creation of new high value – added technologies and accumulated technologies such as ultra low power consumption and embedded memory processes, we will contribute to the realisation of the IoT world and a sustainable society in which people and technology live in harmony.

GSEC – Fabs in association with leading Japanese  &  European Companies comes in with the State of the art technologies in the Memory & Logical segments of the semiconductor industry. GSEC – Fab plans to initially set up two Fab Modules:

• Fab Completion (Module 1) in 300mm or higher wafer size  Planned project start Q4 2018 , 130 nm, 90nm, 55nm, 40nm, 3D Semiconductor & Packaging Technologies to be completed in 2021.
• Fab Completion (Module 2) in 300mm or higher wafer size – Construction to start in Q2 2019, 28nm/15nm/7nm – 3D Semiconductor & Packaging Technologies to be completed in 2022

Technology Proposed

GSEC will enter into a Memorandum of Understanding (MoU) with the help of partners like Neotec Semiconductor Limited (Taiwan) and others for licensing of the Fab definition and process technologies for 300mm wafer operations with two wafer fab modules, constructed sequentially. The core technologies forecasted for these modules will be CMOS logic technology platforms.

Fab module 1 will specialize in the following technologies:

1. 90nm: Projected to be operational end of 2021; a mature technology which will support the start-up and the debugging of the clean room and the Fab infrastructures. It may be, in future, differentiated with additional features (analog, embedded flash etc.) for widening the scope of applications
2. 55nm: Projected to be transferred in 2021; very rich node, which could be differentiated for analog applications, RF or Smart Card Applications, with Non Volatile Memories (eNVM)
3. 40nm: Projected to be transferred in 2021; very rich node for wireless applications and any digital Application Specific Integrated Circuits (ASIC) devices which will likely be the core technology to serve multiple applications for a long period of time

Fab module 2 will specialize in 28nm/14nm nodes. Their date of introduction will be defined according to the progress of the project in the horizon 2022-2023, and the business visibility at that time; tentatively 2022. However, the industry is showing great expectations related to this module and its advanced technologies, thereby potentially expediting its implementation.

The selection of these nodes are based on potential products to be manufactured by GSEC both for Indian and overseas customers. It should be noted that these nodes are far more advanced than what was initially proposed and approved. The technologies proposed are:

1. State-of-art from the performance and manufacturability perspective, as offered by leaders in the industry
2. Supported by relevant design platforms that will be also transferred during the project, with the relevant IP’s and Design Solutions, allowing immediate design on these technologies.
3. Proven from industrial point of view, because they will be produced in high volumes either at technology partner manufacturing locations or at their foundry partner locations; further, all licensed technologies have generated a very significant amount of production data obtained from real manufacturing environments. This will facilitate the transfer of these technologies in a similar manufacturing environment and will considerably increase the stability and robustness of the transferred technology.
4. Qualified and accepted by technology partner customers, with the warranty of robustness, reliability and maturity needed for addressing the market

Besides the above process technologies, our technology partner will offer expertise and advice for the technology transfer and setting up of the GSEC Fab, as well as license its design libraries. This is expected to enable a faster ramp-up of product development for GSEC.

Further our technology partner will provide to GSEC program management expertise through a dedicated program management team. This will include the following:

1. Advise with respect to the design of the manufacturing facility including clean room, layout of equipment, building, design, piping, gas, power, water, waste etc.
2. Advise with respect to specifications and procurement of manufacturing equipment and installation at site.
3. Advise with respect to the building control system.
4. Advise with respect to software to run equipment and software to run the manufacturing facility.