The GSEC Eco-System with Major Global Technology & Contract Manufacturing Partners as TEAM GSEC are coming up in India in multiple tranches of about 30,000 acres each with investments of over USD 10 to 20 billion each, over a period of 5 years with initial focus on mobility, automotive, defense & aerospace, communication & data center, internet of things etc.
TEAM GSEC would gradually move from the Electronic Products to the other segments of the Eco-system i.e. from the Product to components to Packaging to Fab with thirteen verticals.
The company’s focus is on the Global & Indian Memory, logic and mixed-signal semiconductor markets.
GSEC is planning to develop a complete Integrated Semiconductor & Electronics Manufacturing ecosystem that will house a number of companies for engineering, software, designing , packaging, components and EMS (Electronic manufacturing services) which will enable India to develop an entirely domestic semiconductor products’ manufacturing ecosystem, as well as, a global Innovation City for Electronic Manufacturing.
GSEC – Developing the full ESDM (Electronics System Design & Manufacturing) Ecosystem in India
GSEC has planned manufacturing at every stage of this life-cycle, offering India its first complete life-cycle fab such as
a. Raw Silicon Manufacturing (purity 97-99%, from Sand)
b. Wafer Grade Silicon Manufacturing (Si Purity >99.9999999%)
c. Mono-Si Ingots
d. Mono-Si Wafer Fabrication (Diamond Cutting to reduce Si wastage)
e. Multiple Semiconductor Fabrication Plants (Digital/Analog)
- Block I – Digital Fab
- Block II – Memory Fab & Analog Fab for customized fab manufacturing
- Block III – Exclusive Zone for Defense Manufacturing (to take care of the strict IPR requirements)
- Block IV – R&D Center & Manufacturing of virgin wafers (used as starting material) by the Wafer Fabs
f. Components, Assembly and Packaging
Samaya Noa Private Limited are the project consultants. (Website: http://www.samayanoa.com)
GSEC has planned the manufacturing facility in two phases, which is as given hereunder.
The following companies would be coming under GSEC phase I, which substantially cover the integrated semiconductor & electronic manufacturing ecosystem, namely:
- GSEC Engineering & Constructions Private Ltd (GSEC - E&C)
- GSEC Foundries Private Ltd (GSEC Foundry –Fab)
- GSEC Components, Assembly, Packaging & Software Private Limited (GSEC – Caps)
- GSEC Consultancy Services Private Limited (GSEC – CS)
- GSEC Infotainment & Telematics Systems Private Limited (GSEC – ITS)
- GSEC Education, Knowledge & Skill Development Private Limited (GSEC – EKS)
- GSEC Smart Industrial Township Private Limited (GSEC – SIT)
- GSEC SMART CITIES Private Ltd (GSEC SMART CITIES)
- GSEC Advanced Materials Private Ltd (GSEC AM)
- GSEC Technologies Private Ltd (GSEC Tech)
- GSEC Electron Private Ltd (GSEC Electron)
- GSEC Hospitality & Services Private Ltd (GSEC HS)
- GSEC Organic Private Ltd (GSEC Org)
The following companies would be coming under GSEC phase II, which substantially cover the integrated semiconductor & electronic manufacturing ecosystem, namely:
- GSEC Silicon Ingots & Wafers Private Ltd (GSEC - SIW)
- GSEC Solar Energy Private Ltd (GSEC –Solar)
- GSEC LED Private Limited (GSEC – LED)
- GSEC Automobiles Private Limited (GSEC – Auto)
- GSEC Avionics & Railways Private Limited (GSEC – AR)
The wafer fabrication section of the complex (the “Fab”) will be set up in two modules, each of them capable of producing 20,000 to 1,50,000 , of 300mm / 450mm , wafers per month; the first module will target technologies from 90nm down to 40nm, optionally including embedded flash memory technology with 3 D enable technologies, and the second one will focus on technologies from 28nm, 14nm down to 7nm with 3D enable technologies.
The following companies would be coming under GSEC substantially covering the Integrated semiconductor & electronic manufacturing ecosystem.
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